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Prof. Dr.-Ing. R. Knechtel

E-Mail an Prof. Dr.-Ing. R. Knechtel über Kontaktformular senden.
Raum: B 4.08
Tel: +49 3683 / 688-5108
Fax: +49 3683 / 688-5499

Lehrgebiete

  • Elektrische Messtechnik
  • Sensorik

Forschung

  • Intelligente Autonome Sensoren
  • Sensortechnologien

Veröffentlichungen

Handbook of Silicon Based MEMS Materials and Technologies”, published by Elsevier 2010, edited by V.K. Lindroos (Helsinki University of Technology (HUT)), M. Tilli (Okmetc Oyj Finland), A.Lehto (Helsinki UT Finland) and T.Motooka (Kyushu University Japan), ISBN: 978-0-8155-1583-8, Subchapters: Glass Frit Bonding, Wafer Bond Characterisation, SOI-Wafer Based Surface Micromachining, CMOS Wafer Bonding by Roy Knechtel

Handbook of Silicon Based MEMS Materials and Technologies”, Second Edition published by Elsevier 2015, edited by V.K. Lindroos (Helsinki University of Technology (HUT)), M. Tilli (Okmetc Oyj Finland), M. Paulasto-Kröckel (Helsinki UT Finland) and T.Motooka (Kyushu University Japan) u.a., ISBN: 978-0323299657, Subchapters: Glass Frit Bonding, SOI-Wafer Based Surface Micromachining, CMOS Wafer Bonding by Roy Knechtel

Handbook of Wafer Bonding,to be published by Wiley-VCH Verlag GmbH & Co. KGaA January 2012, edited by Peter Ramm (Fraunhofer EMTF Munich, Germany , James Jian-Qiang Lu (Rensselaer Polytechnic Institute Troy, NY, USA) and Maaike M. V. Taklo (SINTEF ICT Oslo, Norway), ISBN: 978-3527326464, Chapter: Glass Frit Wafer Bonding by Roy Knechtel 

Konferenzbeiträge und Artikel

2018

Roy Knechtel, Matthias Zellmer, Marc Schikowski, Martin Behmüller, Carl Van Buggenhout, Anastasios Petropoulos: Glass Frit Wafer Bonding for Encapsulating Monolithic Integrated CMOS-MEMS Devices - Semiconductor Wafer Bonding 15, Science, Technology, and Applications, ECS Meeting October 2018 Cancun / Mexico, Electrochemical Society, Pennington, NJ USA, 2014, ISBN 978-1- 62332-536-7

Roy Knechtel, Uwe Schwarz, Lutz Ende, Wolfgang Einbrodt, Steffen Leopold: Ion Implantation for MEMS Processes, 22nd international Conference on Ion Implantation Technology (IIT 2018) Würzburg Germany September 16-21, 2018 

2017

Sophia Dempwolf, Lutz Hofmann, Christopher Bowers, Daniela Guenther, Roy Knechtel,        Ronny Gerbach: Approaches for Wafer Level Packaging and Heterogeneous System Integration for CMOS and MEMS Sensors– 5thIEEE International Workshop on Low Temperature Bonding for 3D Integration, The University of Tokyo, Japan May 16-18, 2017 

Volker Herbig, Roy Knechtel, Mario von Podewils: From sampling to ramping: the long way towards high volume MEMS production – European MEMS & Sensors Summit, Grenoble France September 20thto 22nd2017

2016

Roy Knechtel, Holger Klingner: Surface Protection for Semiconductor Direct Bonding - Semiconductor Wafer Bonding 14, Science, Technology, and Applications, ECS Meeting October 2016 Hawaii, Electrochemical Society, Pennington, NJ USA, 2014, ISBN 978-1- 62332-368-4 

Roy Knechtel, Sophia Dempwolf, Holger Klingner: Glass Frit Wafer Bonding Sealed Cavity Pressure in Relation to Bonding Process Parameters - Semiconductor Wafer Bonding 14, Science, Technology, and Applications, ECS Meeting October 2016 Hawaii, Electrochemical Society, Pennington, NJ USA, 2014, ISBN 978-1-62332-368-4 

2015

Lutz Hofmann, Sophia Dempwolf, Danny Reuter, Ramona Ecke, Knut Gottfried, Stefan Schulz, Roy Knechtel, Thomas Geßner: 3D integration approaches for MEMS and CMOS sensors based on a Cu Through-Silicon-Via technology and wafer level bonding- SPIE Microtechnologies 2015 Barcelona, May 2015

Sophia Dempwolf, Roy Knechtel, Holger Klingner, Thomas Weidner: Challenges of Glass Frit Wafer Bonding in a Production Environment, WaferBond ’15 - The Conference on Wafer Bonding for MEMS, 3D- and Wafer Level Integration, Braunschweig / Germany December 2015

2014

Roy Knechtel, Sophia Dempwolf, Uwe Schwarz: Wafer Bonding Processes in Surface Micromachining Technologies for Inertial Sensor Systems – Smart  Systems Integration for Micro- and Nanotechnologies, Honorary volume on the occasions of Thomas Gessner’s Birthday 2014 – ISBN 978-3-9324434-78-5

Roy Knechtel, Siegfried Hering, Sophia Dempwolf: Detailed Investigations of Inner Cavity Pressure of MEMS Devices Sealed by Wafer Bonding- Semiconductor Wafer Bonding 13, Science, Technology, and Applications, ECS Meeting October 2014 Cancun, Electrochemical Society, Pennington, NJ USA, 2014, ISBN 978-1-62332-185-7

[Roy Knechtel, Natalie Frohn, Holger Klingner: Surface Characterization for and by Semiconductor Wafer Direct Bonding - Semiconductor Wafer Bonding 13, Science, Technology, and Applications, ECS Meeting October 2014 Cancun, Electrochemical Society, Pennington, NJ USA, 2014, ISBN 978-1-62332-185-7

2013

Sophia Dempwolf, Roy Knechtel: MEMS 3-Axis Inertial Sensor Process- Design, Test, Integration and Packaging (DTIP) of MEMS/MOEMS Barcelona, Spain 16-18 April 2013

Roy Knechtel: Temperature Measurements in Micro-System-TechnologiesTemperature and Air Humidity Measurements - History and Future Proceedings Opening Lectures Traveling Exhibition „From Observation to Measurement“ German Thermometer Museum Geraberg, February 2013

2012

Roy Knechtel: Low temperature Wafer Bonding for MEMS-Processes and 3D-Integration- 3rdIEEE International Workshop on Low Temperature Bonding for 3D Integration, The University of Tokyo, Japan May 22-23, 2012 

Sophia Dempwolf, Roy Knechtel, Uwe Schwarz: Ready-To-Use MEMS – Innovations at X-FAB-Microsystems Technology in Germany 2012, trias consult Berlin, 2012, ISSN 2191-7183

Roy Knechtel, Holger Klingner, Natalie Frohn, Heike Wünscher: Surface Activation for Semiconductor Wafer Direct Bonding Using Polymer-Stripping Wet Chemicals-  Semiconductor Wafer Bonding 12, Science, Technology, and Applications, ECS Meeting October 2012 Hawaii, Electrochemical Society, Pennington, NJ USA, 2012, ISBN 1-62332-006-5

Roy Knechtel, Siegfried Hering, Sophia Dempwolf: Monitoring Inner Pressure of MEMS Devices Sealed by Wafer Bonding- Semiconductor Wafer Bonding 12, Science, Technology, and Applications, ECS Meeting October 2012 Hawaii, Electrochemical Society, Pennington, NJ USA, 2012, ISBN 1-62332-006-5

2011

Hans Geiler, Kristian Schulz, Roy Knechtel: Characterization of Bonded Wafer Stacks by Use of the Photoelasticanalysis Method, WaferBond ’11 - The Conference on Wafer Bonding for MEMS, 3D- and Wafer Level Integration, Chemnitz / Germany December 2011

Sophia Dempwolf, Roy Knechtel: Investigation of Glass Frit Bonding on Various Surface Layers, WaferBond ’11 - The Conference on Wafer Bonding for MEMS, 3D- and Wafer Level Integration, Chemnitz / Germany December 2011

Roy Knechtel: Stud Pull Testing of Ultra-Small Waferbonded Chips Using Microstructured Adapters, WaferBond ’11 - The Conference on Wafer Bonding for MEMS, 3D- and Wafer Level Integration, Chemnitz / Germany December 2011

Sophia Dempwolf, Roy Knechtel, Siegfried Hering, Thomas Link, Martin Trächtler, Jan Dehnert, Daniel Hoffmann, Acceleration Sensors IP-Blocks for MEMS Foundry Surface Micromachining Process,Innovationsforum Mikrotechnik Villingen Schwenningen / Germany, February 2011

Roy Knechtel, Sophia Dempwolf, Siegfried Hering, Thomas Link, Martin Trächtler, Jan Dehnert: Acceleration Sensors IP-Blocks for MEMS Foundry Surface Micromachining Process - SENSOR+TEST Conferences 2011, June 2011, Nuremberg / Germany June 2011, ISBN 978-3-9810993-9-3

2010

Roy Knechtel: Reliability Tests and Technology Qualification of Wafer Bonded Microsystems - 11. Chemnitzer Seminar für Nanotechnology, Nanomaterials and Nanoreliability, 6. October 2010, Chemnitz / Germany

Roy Knechtel: Wafer Bonding as Key Process for Wafer Level Packaging-1. Chemnitzer Seminar für Nanotechnology, Nanomaterials and Nanoreliability, 20. January 2010, Chemnitz/ Germany, published in Micromaterials and Nanomaterials issue 12 2010, ISSN 1619-24   

Steffen Michael, Roy Knechtel:Stressidentifikation dünner Membranstrukturen mittels dynamischer Messungen- 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik - Chemnitz, 20./21. Oktober 2010

Roy Knechtel, Tutorial MEMS Technologies in a Pure Play Wafer Foundry Part II MEMS-Foundry Technology for Inertial Sensors- 11. ITG/GMM-Fachtagung Analog 2010, Erfurt, 22.- 24.03.2010

Roy Knechtel, Daniel Gäbler: Dielectric Layer Transfer by Low-Temperature Wafer Bonding for Optical CharacterizationSemiconductor Wafer Bonding 11, Science, Technology, and Applications, ECS Meeting October 2010 Las Vegas, Nevada

2009

Roy Knechtel, Gisbert Hölzer, Stephen Breit, Gerold Schröpfer: 3-D Process Modeling - A Novel and Efficient Tool for MEMS Foundry Design Support - The 20th Annual IEEE/SEMI® Advanced Semiconductor Manufacturing Conference ASMC 2009 (in cooperation with ISSM) May 11-13, 2009 (in publication)

Roy Knechtel: Single crystalline silicon-based surface micromachining for high-precision inertial sensors: technology and design for reliability - SPIE Europe Microtechnologies for the New Millennium Smart Sensors, Actuators and MEMS, Dresden Mai 2009 

Gisbert Hölzer, Roy Knechtel: 3-D Process Modeling - A Novel and Efficient Tool for MEMS Foundry Design Support- 2009 Advanced Semiconductor Manufacturing Conference, presented at Semicon West July 2009 and Semicon Europe Dresden October 2009 

Roy Knechtel: Single Crystalline Silicon Based Surface Micromachining for High Precision Inertial Sensors - Technology and Design for ReliabilityPublished by Springer-Verlag GmbH, Microsystem Technologies ISSN: 0946-7076 (Paper) 1432-1858 (Online)  Issue: Volume 16, Numbers 5  Date: March 2006  Title: Special Issue of the Conference ‘Smart Sensors, Actuators and MEMS’, within the SPIE Europe Symposium ‘Microtechnologies for the New Millennium’ Dresden, Germany, 4–6 May 2009;  DOI: 10.1007/s00542-010-1062 

Sophia Dempwolf, Roy Knechtel: Standardized Bond Test Wafers for Evaluation of Wafer Bonding Technologies, WaferBond ’09 - The Conference on Wafer Bonding for MEMS, 3D- and Wafer Level Integration, Grenoble / France December 2001

Roy Knechtel, Sophia Dempwolf, Holger Klingner: Special Aspects of Anodic Wafer Bonding for MEMS applications, WaferBond ’09 - The Conference on Wafer Bonding for MEMS, 3D- and Wafer Level Integration, Grenoble / France December 2009

2008

Roy Knechtel: Aspects of Bonding Processed CMOS Wafers - Semiconductor Wafer Bonding 10, Science, Technology, and Applications, ECS Meeting October 2008 Hawaii

Roy Knechtel: Characterization and Qualification of Wafer Bonded MEMS devices    Semiconductor Wafer Bonding 10, Science, Technology, and Applications, ECS Meeting October 2008 Hawaii

2007

Roy Knechtel: Wafer to Wafer 3-D Integration Using Conductive Glass Frit Bonding- Smart System Integration 2007 Paris, March 27-28, 2007       

Roy Knechtel: Silicon Processes and IP-Blocks for Pressure Sensors, Sensor and Test 2007 Forum Presentation - Nuremberg May 23, 2007

Roy Knechtel: MEMS-Foundry Technology for High-Performance Gyroscopes - Symposium Gyro Technology 2007, Karlsruhe Germany, September 18-19, 2007

Roy Knechtel, Jens Urban:Wafer Level encapsulation of MEMS using ultra small and thin silicon caps - Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration 2007, Halle/Saale Germany, December 9-11, 2007 

[Roy Knechtel: Inspection of bond areas and MEMS structures of silicon wafer stacks - Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration 2007, Halle/Saale Germany, December 9-11, 2007  

2006

Roy Knechtel: Wafer Bonding in Industrial MEMS Processing - SUSS-Report Issue 01 – 2006, SUSS Micro-Tec AG, Garching by Munich, April 2006

Joerg Bagdahn, Christian Dresbach, Matthias Ebert, Karsten Glien, Juergen Graf, Roland Mueller-Fiedler, Roy Knechtel: Investigation of the mechanical robustness of glass frit wafer-bonded micro packages for automotive applications - 4thAnnual, MEMS Packaging Symposium, San Jose, May 17/18, 2006

Roy Knechtel: Wafer Bonding Technologies in Industrial MEMS Processing - Potentials and Challenges, Invited PaperSemiconductor Wafer Bonding 9, Science, Technology, and Applications, page 341, ECS Transactions, 3 (6) 341-354 (2006), Electrochemical Society, Pennington, NJ USA, 2006, ISBN 156677506-X

Roy Knechtel, Maik Wiemer, Jörg Frömel: Wafer Level Encapsulation of Microsystems Using Glass Frit Bonding- Published by Springer-Verlag GmbH, Microsystem Technologies ISSN: 0946-7076 (Paper) 1432-1858 (Online)  Issue: Volume 12, Numbers 5  Date:  March 2006 Title: Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11-12 October 2004;  DOI: 10.1007/s000542-005-0036-4

Roy Knechtel, Michael Knaup, Jörg Bagdahn: A Test Structure for Characterization of the Interface Energy of Anodically Bonded Silicon-Glass Wafers- Published by Springer-Verlag GmbH, Microsystem Technologies ISSN: 0946-7076 (Paper) 1432-1858 (Online)  Issue: Volume 12, Numbers 5  Date:  March 2006 Title: Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11-12 October 2004;  DOI: 10.1007/s000542-005-0036-4

Roy Knechtel: Characterisation And Quality Monitoring of Bonded Wafers in Industrial MEMS Processes -Workshop on Wafer Bonding for MEMS Technologies, Halle, April 2006

2005

Roy Knechtel: Glass Frit Bonding - An Universal Technology For Wafer Level Encapsulation and Packaging - Published by Springer-Verlag GmbH, Microsystem Technologies ISSN: 0946-7076 (Paper) 1432-1858 (Online)  Issue: Volume 12, Numbers 1-2          Date: December 2005  Title: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Montreux, Switzerland, 12-14 May 2004;  DOI: 10.1007/s00542-005-0022-x

Roy Knechtel: Halbleiterwaferbondverbindungen mittels strukturierter Glaszwischen-schichten zur Verkapselung oberflächenmikromechanischer Sensoren auf Waferebene - Dissertation Verlag Dr. Hut, 2005, ISBN3-89963-166-8

Roy Knechtel, Gerald Dahlmann, Uwe Schwarz: Low- And High-Temperature Silicon   Wafer Direct Bonding for Micromachined Absolute Pressure Sensors - Semiconductor Wafer Bonding VIII: Science, Technology, and Applications, Seite 205, Electrochemical Society, Pennington, NJ USA, 2005, ISBN 1-56677-460-8

Gerald Dahlmann, Roy Knechtel, Siegfried Hering: Fabrication of Piezoresistive Pressure Sensors by Low Temperature Silicon Direct Bonding - Sensor’05  Kongress, Nürnberg  

R. Knechtel, Michael Knaup, Jörg Bagdahn, Maik Wiemer:Non-Destructive Strength Testing of Anodic Bonded Glass-Silicon Wafer Compounds - Micro System Technologies, München, 5.-6. Oktober 2005

2004

Roy Knechtel: Glass Frit Bonding – an universal technology for wafer level encapsulation and packaging- Design, Test, Integration and Packaging (DTIP) of MEMS/MOEMS Montreux, Schweiz, 12.-14. Mai 2004

Appo van der Wiel, Roy Knechtel: Integrated motion and pressure sensor for TPMS - Tire Technology Expo, Stuttgart, 2004   

Jörg Bagdahn, Matthias Ebert, Heiko Knoll, Jürgen. Graf, Karsten Glien, R. Knechtel, Maik Wiemer: Untersuchungen zur Zuverlässigkeit Sealglas gebondeter Sensoren-Sitzung Fachausschuss 4.8 Werkstoffe und Fertigungsverfahren des Fachbereichs  4 Mikrosystemtechnik und Nanotechnologie der VDI/VDE-Gesellschaft für Mikroelektronik, Mikro- und Feinwerktechnik (GMM) 25.05.2004

Roy Knechtel, Maik Wiemer, Jörg Frömel: Wafer level Encapsulation of microsystems using glass frit bonding - Workshop on Wafer Bonding for MEMS Technologies, Halle, Oktober 2004

Roy Knechtel, Jörg Bagdahn, Matthias Knaup, Maik Wiemer:  An non-destructiv test structure for bond strength evaluation in silicon-glass bonds - Workshop on Wafer Bonding for MEMS Technologies, Halle, Oktober 2004

2003

Roy Knechtel: Wafer level encapsulation of surface micromechanical sensors demands and solution- Micro System Technologies, München, 7.-8. Oktober 2003

Roy Knechtel: Glass-Frit-Waferbonden: Verbindungsbildung, technologischer Ablauf und Anwendung- 6. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik - Chemnitz, 29./30. Oktober 2003  

Roy Knechtel, Ronald Kumst: Untersuchung von Prozesseinflüssen und Zuverlässigkeitseigenschaften anhand von mittels Si-Si-Hochtemperaturbonden hergestellter Substrate für Absolutdrucksensoren -6. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik - Chemnitz, 29./30. Oktober 2003  

Roy Knechtel: Glass Frit Wafer Bonding Technology and ApplicationsDVS Arbeitsgruppe A2.6 Waferbonden, Jahressitzung Dezember 2003

Roy Knechtel, Jutta Heller, Maik Wiemer, Jörg Frömel: Silicon wafer bonding for encapsualation of surface-micromechanical-systems using intermediate glass layers- Semiconductor Waferbonding VII: Science, Technology, and Applications, Seite 321, Electrochemical Society, Pennington, NJ USA, 2003, ISBN 1-56677-402-0

2002

Thomas Hülsmann, Roy Knechtel u.a., Infobörse Mikrosystemtechnik Nr. 34-2002 Niedertemperatur-Silizium-Silizium-Bonden (NTB),Informationsreihe VDI/VDE-Technologiezentrum Informationstechnik GmbH, 2002

Roy Knechtel: Wafer bonding for industrial MEMS production processes - Workshop on Wafer Bonding – Barcelona 30th September to 1st October 2002

2001

Roy Knechtel, Uwe Schwarz: CMOS und MEMS verbünden sich - X-FAB-Aktivitäten im Bereich der integrierten Mikromechanik- Elektronik Industrie 04/2001

Roy Knechtel,  Klaus-DieterPreuß: Methoden zur Vermeidung von natriumhaltigen Ablagerungen auf der Oberfläche anodisch gebondeter Glaswafer- 5. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik - Chemnitz, 23./24. Oktober 2001

2000

Roy Knechtel: Significance of surface characterisation in the fabrication of micromechanical systems- Workshop on optical testing, Veeco Meteorology Group Manheim 29.02.2000

Merlijn van Spengen, Ingrid De Wolf (IMEC), Roy Knechtel: Experimental one- and two-dimensional mechanical stress characterization of silicon microsystems using micro-Raman spectroscopy - SPIE Materials and Device Characterization in Micromachining III; September 2000; Santa Clara, CA, USA. pp 132-139

Patente

[I]         Karlheinz Freywald, Roy Knechtel: Verfahren und Anordnung zum Passivieren anodischer Bondgebiete, die über elektrisch aktiven
Strukturen von mikroelektromechanischen Systemen angeordnet sind (Micromechanical System: MEMS)
, DE 101 29 821.8 A1

[II]        Roy Knechtel, Jutta Heller, Gunnar Lindemann: Verfahren zum Vereinzeln von Halbleiterscheiben mit frei liegenden mikromechanischen Strukturen zu Chips, EP000001599412A1

[III]       Roy Knechtel, Siegfried Büttner: Verfahren zur Herstellung eines in Kunststoff verschlossenen optoelektronischen Bauelementes und mit dem Verfahren hergestelltes Bauelement, DE000010322751B3

[IV]      Roy Knechtel: Verfahren zum Verbinden prozessierter Halbleiterscheiben, bei dem neben dem festen isolierenden Zusammenfügen auch eine elektrische Verbindung hergestellt wird und entsprechende Anordnung, DE000010350460A1

[V]       Roy Knechtel, Andrej Lenz: Verfahren und Anordnung zur Herstellung von Halbleitersubstraten mit vergrabenen Schichten durch Verbinden von Halbleiterscheiben (Bonden), DE000010355728A1

[VI]      Roy Knechtel: Verfahren und Anordnung zur elektrischen Bestimmung der Verbindungsqualität gebondeter Scheibenverbindungen, DE102005001104B3

[VII]     Roy Knechtel: Hermetisch dichtes Verschließen und elektrisches Kontaktieren einer mikroelektro-mechanischen Struktur und damit hergestelltes Mikrosystem (MEMS), DE112007001698A5

[VII]     Roy Knechtel: Verfahren zur Herstellung von Justagestrukturen für eine strukturierte Schichtabscheidung auf einem Mikrosystemtechnikwafer mittels einer Beschichtungsmaske, DE102007027434A1

[IX]      Roy Knechtel, Uwe Schwarz: Verfahren zum Übertragen einer Epitaxie-Schicht von einer Spender- auf eine Systemscheibe der Mikrosystemtechnik, WO002009013255A2

[X]       Sophia Dempwolf, Roy Knechtel, Uwe Schwarz:Verfahren zur Herstellung von komplexen mikroelektromechanischen Systemen, DE102012013096A1