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MatInWLP

Material innovations for wafer-level packaging technologies

Subject of research

Wafer-level packaging (WLP) is an emerging, resource-saving technology in microsystems technology that also enables higher integration densities in the resulting electronic components. In addition, WLP is significantly more sustainable, as it requires less material and energy. The planned research project pursues an interdisciplinary approach of microsystems technology and materials science to harness new material concepts and processes for WLP in microelectronic production.

Results

  • Development of high-performance wafer bonding systems and solderable metallizations based on resource-saving thin-film systems
  • Evaluation of innovative 3D electronics printing technologies for structured deposition at wafer level
  • Development of a concept for the efficient introduction of new and environmentally compatible materials and recyclable process chemistry in production and large research cleanrooms

Involved institutions and contact

Schmalkalden University of Applied Sciences
Faculty of Electrical Engineering
Am Blechhammer 9
98574 Schmalkalden
Prof. Dr.-Ing. Roy Knechtel (Project Coordination)
Dr.-Ing. Martin Seyring

Friedrich Schiller University Jena
Institute for Applied Physics
Albert-Einstein-Str. 15
07745 Jena
PD. Dr.-Ing. habil. Stephanie Lippmann

Third-party funder

Carl-Zeiss-Stiftung
Programm: CZS Transfer
Projekt-Nr: P2022-09-0001

Additional information

Digital model of a structure to be created and next to it the 3-dimensional print result as a surface profile (z-stack)
Cross-section preparation of a wafer-level package with soldered metallization (left); detailed image of the solder joint in the SEM (middle) and the corresponding element distribution determined by EDX (right)